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THINK ADDITIVE:MEMS封装材料的喷墨沉积

发布时间:2004-11-18
发布人:

THINK ADDITIVE:Ink-Jet Deposition of Materials for MEMS Packaging

D. Wallace, D. Hayes, T. Chen, V. Shah, D. Radulescu, P. Cooley, K. Wachtler, and A. Nallani, 6th Topical Workshop on Packaging of MEMS and Related Micro-Nano-Bio Integrated Systems, Long Beach, CA, Nov. 18-20, 2004.